• CQ9

    Our Automation Systems

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    Jabil Precision Automation

    CP150 Series Automation System

    Flexible, High-Precision Automation Systems

    The CP150 automation platform delivers future-proof flexibility to any production line by delivering a highly-modular, scalable system that addresses a variety of automation needs.

     

    cp150_automation_system

    Enhanced Capabilities 

    Metrology

    We design and deliver non-contact metrology solutions that increase production throughput and repeatability.

    • Ability to identify cosmetic defects, coating thickness, gaps, and offsets

    • High-speed multi-angle light triggering

    • Custom AI Defect generation software

    Optical Inspection

    Our inspection capabilities allow you to identify and measure micron-level defects and surface flaws to ensure your products maintain the highest standards of quality.

    • Cosmetic Defects
    • Coating Defects
    • Surface Finishes
    • Gaps and Offsets
    • Color and Gloss

    Lamination

    The ability to align, place, and cure our lamination capabilities delivers a streamlined process in your manufacturing processes.

    • Alignment repeatability within 10 microns
    • Scaleable for a variety of rigid and flexible material combinations
    • Non-contact “Bernoulli End-Effector” loading and unloading of materials
    • Automatic Planarity Adjustment

    High-Speed Final Assembly

    When it comes to high-speed, high-precision assembly we deliver robust capabilities designed to help you achieve your manufacturing goals.

    • Label Placement
    • Point-to-Point Soldering
    • Precision Dispensing
    • High-Speed Pick and Place
    • Vision-Based Alignment
    • Robotic Screw Fastening

    Key Benefits

    High Flexibility

    The CP Series allows for a variety of configurations that can support any number of interrelated processes, production speeds, and quality levels. Configure pallet or edge-belt conveyors with either a reversible left-to-right or right-to-left conveyor flow to optimize your manufacturing processes.

    Multiple Levels of Automation

    The platform supports a wide range of processes, ranging from semi-automatic to fully automated modes, to help support your manufacturing objectives.

    Redeployable

    Future proof your investment by re-deploying the CP Series work cell for various applications. Common interfaces enable rapid change-over of applications; saving you time and money.

    Key Features

    • Platforms can be configured in any orientation ensuring optimal support of interrelated processes, production speeds, and quality levels
    • Modular Z-axis and Theta axis (optional) available
    • Multiple Vision locations options (up-camera or down-camera)
    • Standardized mounting flanges and control interfaces
    • Quick-change feeder mounting available
    • OSHA and ANSI compliant

    CP150 Specifications

    Machine Footprint

    • 1495mm (W) x 1275mm (D) x 1800mm (H)
    • 1495mm (W) x 1275mm (D) x 2268mm (H) – With Light Tower

    Work Envelope

    • 700mm (X-axis) x 700mm (Y-axis)

    Axes of Motion

    • 4 Axes (X, Y, Z, T) – Standard
    • 3 axes optional, Up to 16 axis compatible

    Z Max. Stroke

    • 100mm – Standard

    Theta

    • 360° – Standard

    Manipulator Payload

    • Rated 3kg, Max. 6 kg (on Z-Axis) – Standard

    Manipulator Repeatability

    • X, Y, Z ±25μm
    • T ±0.005°

    Utility Requirements

    • Power 220VAC ±10%, 50/60Hz, 25 Amp
    • Air 5.2-6.9 bar, 57 L/min

    Product Presentation

    • Edge Belt Conveyor
    • Pallet Conveyor
    • Manual Load
    • Dual Shuttle
    • Rotary Table

    Feeder Slots Available

    • Feeders (Label, Tape, Reel, Tube)
    • Tray Loader/Unloader
    • Manual Load Stack

    Electrical I/O

    • User I/O – 24 VDC, 16 General Purpose Inputs / 16 General Purpose Outputs (NPN)
    • Expansion I/O – 16 Inputs / 16 Outputs per expansion card (NPN)
    • Remote I/O – 20 Inputs / 12 Outputs per Remote card (NPN)

    Pneumatic

    • Remote valve bank(s) optional
    • Remote Vacuum Optional

    MES Connectivity

    • Jabil ARVIS Visual Programming Environment

    Controls

    • Advantech PC with Windows 10
    • Beckhoff TwinCAT3 Controller
    • ARVIS PC GUI

     

    SIM500 Series Automation System

     

    A Flexible, Cost-Effective Automation System

    Jabil’s Standard Integration Module (SIM) platform utilizes interchangeable modules to automate basic to complex production applications. Pre-engineered solutions minimize risks, simplify integration, and reduce lead-time. SIM platforms can be used inline or as stand-alone workstations.

     

    SIM500_automation_system

    Key Capabilities

    • Pick and Place

    • P2P Soldering

    • Screw Fastening

    • Label Placement

    • Vision-Based Alignment

    • Precision Dispensing

    Key Features

    • The SIM is a re-deployable system featuring common interfaces that enable rapid change-over of applications

    • The platform supports a range of processes from semi-manual to fully automated

    • The platform can be fitted with a pallet conveyor or edge belt conveyor, with reversible left-to-right or right-to-left conveyor flow

    • Platforms can be configured in any orientation ensuring optimal support of interrelated processes, production speeds, and quality

    • Modular Z-axis and optional Theta axis

    • Vision locations options (up-camera or down-camera)

    • Standardized mounting flanges and control interfaces

    • Quick-change feeder mounting

    • Full safety guarding (OSHA and ANSI compliant)

    Equipment Options

    • XYZ Cartesian
    • Edge Belt or Pallet Conveyor
    • Pneumatic Shuttle (future)
    • Board Support (tall stroke)
    • Theta Axis on Manipulator

    • Vision Up-Camera or Down Camera

    • Barcode Reader

     

    SIM500 Specifications
    Machine Footprint
    • 1118mm x 1600mm
    Work Envelope
    • With Clinch Envelope 76mm x 76mm to 356mm x 240mm
    • With Board Support 76 x 76mm to 356 x 254mm
    Axes of Motion
    • 4 Axes (X, Y, Z, T)
    Z Max. Stroke
    • 180mm
    Theta
    • 360°
    Manipulator Payload
    • Rated 3kg, Max. 6 kg (on Z-Axis)
    Manipulator Repeatability
    • X, Y, Z ±50μm
    • T ±0.005°
    Utility Requirements
    • Power 220VAC ±10%, 50/60Hz, 30 Amp
    • Air 5.2-6.9 bar, 57 L/min
    Product Presentation
    • Edge Belt Conveyor
    Feeder Slots Available
    • 4 Slots (6 and 10 slots optional)
    Electrical I/O
    • User I/O 56 Inputs / 48 Outputs
    • Expansion I/O 27 Inputs / 20 Outputs (expandable by using stackable modules)
    Pneumatic
    • 14 Valves Wired
    MES Connectivity
    • Jabil IQware™ Visual Programming Environment
    Controls
    • Advantech PC with Windows
    • Epson RC-180 Motion Controller
    • Epson Manual Control Pendant
     

    IQPS Series Automation System

    A Flexible, Cost-Effective Odd-Form Automation System

    The IQps™ is a low-cost automation platform that offers an ideal solution for Odd Form Pick-and-Place and other circuit assembly applications. Easy-to-use motion and vision controls provide excellent capabilities. Standard assembly tools provide great system flexibility. Fully configurable, the IQps™ is an excellent choice for standard and custom odd form applications.

     

     

    IQPS odd form automation system

    Key Features

    • Active or programmable lead clinch

    • Ability to handle virtually all component types

    • Quick-change feeder slots

    • Edge belt conveyor with board stop and board locating tooling

    • EPSON 4-axis SCARA Robot with motion controller

    • Simple, intuitive IQware™ application software

    • EPSON 4-axis SCARA Robot with motion controller
    • Simple-to-use IQware™ application software and intuitive operator interface, via Windows PC and manual control pendant
    • Edge belt conveyor with board stop and board locating tooling, as well as board support
    • Active or Programmable Lead clinch (optional)
    • Quick-change feeder slots accept all standard part feeders. Options for 4, 6, or 10 feeders
    • Compatible with standard CHAD Grippers, including standard mechanical and vacuum grippers, plus the CHAD PIE™ compliant gripper
    • Ability to handle virtually all component types, including axials, radials, pin headers, capacitors, connectors, transformers, relays, TO-220’s, displays, LED’s and more
    • Custom specifications can be accommodated
    • Full safety guarding (OSHA and ANSI compliant)

    System Options

    • Active Clinch Heads
    • Programmable Single Pin Clinch
    • 3-Section Conveyor
    • Auto-Width Conveyor
    • Vision Board locations or Part locations
    • Bar Code Reader
    • Product Traceability Options

    Grippers

    • SGE Single Grip End Effector (mechanical or vacuum)
    • MGE Multi-Grip End Effector
    • PIE 3D Compliant “Floating” Gripper

    Feeders

    • RC Radial Tape Feeder
    • AF Axial Tape Feeder
    • TM Tube Magazine Feeder
    • Bowl & Inline Feeder
    • Tray Feeder

    WaferMate 300 Series Wafer Handling System

     

    High-Performance Wafer Handling Automation Systems

    The WaferMate300 is a highly configurable, BOLTS-compatible robotic wafer-handling platform that mates high performance with cost competitiveness. As an ISO Class-2 clean EFEM, this platform includes all applicable mini-environment components, E84 compliance, and rear hand-off.

     

    WaferMate 300 Wafer Handling System

    Key Features

    • Supports a wide range of wafer process tools & environments

    • Available in single and dual load port configurations

    • Can service up to 3 process tools at once

    • Adaptable for 200mm and smaller substrates

    • Offering a range of end effector technologies - including vacuum, Bernoulli non contact, edge grip, and more
    • Full safety guarding (OSHA and ANSI compliant)
    • Cleanliness levels down to ISO Class-2
    • CE, SEMI S2, and SEMI S8 Compliant

    Available Accessories

    • FOUP Opener
    • SMIF Pod Opener
    • Aligner
    • Optical Character Recognition (OCR) Systems
    • Barcode Readers
    • Radio Frequency Identification (RFID)
    • Ionization Bars
    • Mini Environment
    • Wafer Flip Module
    • Pallet Transfer Station
    • Wafer Conveyor / Oven Interface
    • SMEMA & SECS/GEM Interfaces
    WM300 Specifications
    Machine Footprint
    • 991mm (W) x 559mm (L) x 2063mm (T) (Single Loadport)
    • 991mm (W) x 1041mm (L) x 2063mm (T) (Dual Loadport)
    Wafer Alignment
    • to ± .05°
    Wafer Placement
    • ±100µm
    Clean Room Classification
    • Up to ISO Class 2 (Optional)
    Wafer Interface Options
    • SMEMA
    • SECS/GEM
    Cassette Positions Available
    • Up to 4 x 200mm Cassettes
    Loadport Positions Available
    • 1 or 2
    MTBF
    • 60,000 hours
    Compliance Standards
    • CE
    • SEMI S2
    • SEMI S8
    Uptime
    • >97%
    Handling Capabilities
    • Thin Wafers
    • Warped Wafers
    • Thick Wafers
    • Glass Wafers
    • Bonded Wafers
    • Perforated Wafers
    • Trenched Wafers
    • Taiko Wafers

     

    WaferMate 200 Series Wafer Handling System

     

    High-Performance Wafer Handling Automation Systems

    The WaferMate200 is a high-performance wafer-handling platform, engineered for the expert automation of semiconductor wafers and similar substrates. The standard SMEMA interface provides the most cost-effective wafer-level process solution for systems that traditionally fit a conveyor layout.

     

    wafermate 200 wafer handling system

    Key Features

    • Pairs seamlessly with multiple types of process tools
    • Configurable for two, three, or four cassette positions
    • Suitable for all open cassette presentation formats
    • Suitable for 50mm to 200mm wafers or 300mm from shipping cassette
    • Can accommodate film frames, special thin and warped wafer components
    • Full safety guarding (OSHA and ANSI compliant)
    • Cleanliness levels down to ISO Class-4
    • CE, SEMI S2, and SEMI S8 Compliant

    Available Accessories

    • Aligner
    • Optical Character Recognition (OCR) Systems
    • Barcode Readers
    • Ionization Bars
    • Mini Environment
    • Wafer Flip Module
    • Pallet Transfer Station
    • Wafer Conveyor / Oven Interface
    • SMEMA & SECS/GEM Interfaces
    WM200 Specifications
    Machine Footprint
    • 1194mm (W) x 769mm (L) x 1812mm (T)
    Wafer Alignment
    • to ± .05°
    Wafer Placement
    • ±100µm
    Clean Room Classification
    • Up to ISO Class 4 (Optional)
    Wafer Interface Options
    • SMEMA
    • SECS/GEM
    Cassette Positions Available
    • Up to 4 x 200mm Cassettes
    MTBF
    • 60,000 hours
    Compliance Standards
    • CE
    • SEMI S2
    • SEMI S8
    Uptime
    • >97%
    Handling Capabilities
    • Thin Wafers
    • Warped Wafers
    • Thick Wafers
    • Glass Wafers
    • Bonded Wafers
    • Perforated Wafers
    • Trenched Wafers
    • Taiko Wafers

     

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    CQ9